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FBI2B5S2.......FBI2M5S2 2. Amp. Glass Passivated Bridge Rectifier Dimensions in mm. 20 Plastic Case 3.5 Voltage 100 to 1000 V. Current 2.0 A. (R) + 1.5 1 + 0.05 1.5 _ L 5 5 5 suffix -4 1 0.5 * Glass Passivated Junction Chips. * UL recognized under component index file number E130180. * Lead and polarity identifications. * Case: Molded Plastic. * Ideal for printed circuit board (P.C.B.). * The plastic material carries U/L recognition 94 V-O. 13.5 7 * Mounting Instructions * High temperature soldering guaranteed: 260 C - 10 sc. * Recommended mounting torque: 8 Kg.cm. Maximum Ratings, according to IEC publication No. 134 FBI2B 5S2 FBI2D 5S2 200 140 80 FBI2F 5S2 300 210 125 FBI2J 5S2 600 420 250 FBI2L 5S2 900 630 380 FBI2M 5S2 1000 700 500 VRRM VRMS VR IF(AV) IFRM IFSM It VDIS Tj Tstg 2 Peak Recurrent Reverse Voltage (V) Maximum RMS Voltage (V) Recommended Input Voltage (V) Max. Average forward current with heatsink without heatsink Recurrent peak forward current 10 ms. peak forward surge current I t value for fusing (t = 10 ms) Dielectric strength (terminals to case, AC 1 min.) Operating temperature range Storage temperature range 2 100 70 40 4.5 A at 65 C 2.0 A at 25 C 15 A 100 A 50 A2 sec 1500 V - 40 to + 150 C - 40 to +150 C Electrical Characteristics at Tamb = 25C VF IR Max. forward voltage drop per element at IF =3 A Max. reverse current per element at VRRM 1.1 V 5A 12 C/W 40 C/W Jan - 00 MAXIMUM THERMAL RESISTANCE Rth (j-c) Junction-Case. With Heatsink. Rth (j-a) Junction-Ambient. Without Heatsink. FBI2 - 5S2 Characteristic Curves TYPICAL FORWARD CHARACTERISTIC FORWARD CURRENT DERATING CURVE 4.5 Tamb = 25 C 10 4 heatsink Tc Tc _ + 3 1.0 on glass-epoxi substrate sine wave R-load on heatsink _ + 2 0.1 1 P.C.B. soldering land 5 mm o sine wave R-load free in air 0 0.6 1.0 1.4 VF , instantaneous forward voltage (V) 0 0 25 50 75 100 125 150 175 Tamb, ambient temperature (C) MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 100 75 50 25 0 1 10 Number of cycles at 50 Hz. 100 Jan - 00 |
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